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IBM Intel Xeon E5-2665 processor 2.4 GHz 20 MB L3

IBM Intel Xeon E5-2690 processor 2.9 GHz 20 MB L3

IBM Intel Xeon E5-2637 processor 3 GHz 5 MB L3

IBM Intel Xeon E5-2630 processor 2.3 GHz 15 MB L3

IBM Intel Xeon E5-2665 processor 2.4 GHz 20 MB L3

TruDDR4 Memory uses the highest quality components that are sourced from Tier 1 DRAM suppliers and only memory that meets the strict requirements of Lenovo is selected. It is compatibility tested and tuned on every System x server to maximize performance and reliability. TruDDR4 Memory has a unique signature that is programmed into the DIMM that enables System x servers to verify whether the memory that is installed is qualified or supported by Lenovo. Because TruDDR4 Memory is authenticated, certain extended memory performance features can be enabled to extend performance over industry standards. From a service and support standpoint, Lenovo memory automatically assumes the Lenovo system warranty and Lenovo provides service and support worldwide.

The ThinkCentre Tiny/Nano Monitor Clamp II is a uniquely designed accessory which secures Tiny or Nano devices onto selected ThinkVision monitors. This mounting device need combined with Tiny VESA Mount II ( 4XF0N03161) or Nano VESA Mount ( 4XF0V81630) for secure mounting functionality.The highly integrated and secured solution will allow you to create a lean working environment and a better user experience.

High Performance MemoryLenovo offers high-performance and high-capacity memory options in ThinkSystem servers.Persistent MemoryLenovo ThinkSystem servers configured with Intel Optane Persistent Memory transforms the memory/storage hierarchy enabling faster insights from data. This breakthrough technology delivers large capacity, high speed, affordable memory with data persistence and advanced encryption capabilities. These DDR4 compatible modules significantly increase the capacity of available system memory, keeping more hot data closer to the CPU, and enabling greater operational efficiency by processing larger data sets with more user instances.3DS RDIMMsTo meet the ever increasing demand for higher density server memory modules, Lenovo offers 3DS (3 Dimensional Stacked) DDR4 RDIMMs which apply TSV (Through Silicon Via) technology from our partnership with a leading Tier 1 DRAM supplier. The new TSV 3DS stack technology enables higher density DRAM stack packages with higher operational frequency and reduced power consumption. The RDIMM configuration along with 3DS TSV DRAM packages exhibits performance benefits and lower power consumption over alternative high density solutions to ultimately provide the lowest TCO for data centers.Performance+ MemoryMemory intensive workloads needing a competitive advantage will benefit from Lenovo’s Performance+ memory. Lenovo engineers worked in partnership with leading memory suppliers to develop and tune ThinkSystem servers enabling them to exceed the latest industry standard for memory performance. Lenovo’s Performance+ memory delivers increased bandwidth and lower latency at 2933 MHz with memory all channels fully populated.

Memory reliability, performance and quality are even more critical today as customers utilize greater memory capacities for Big Data Analytics, Cloud Computing, Virtualization, Database and High Performance Computing workloads. Lenovo offers TruDDR4 Memory portfolio for ThinkSystem servers which help dramatically improve workload performance.

IBM Intel Xeon E5-2643 processor 3.3 GHz 10 MB L3