Features |
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Interface | PCI Express 4.0 |
Component for | Server |
SSD capacity | 960 GB |
Read speed | 7000 MB/s |
Write speed | 1300 MB/s |
Memory type | 3D TLC |
PCI Express interface data lanes | x4 |
Random read (4KB) | 540000 IOPS |
Random write (4KB) | 47000 IOPS |
Read latency | 70 µs |
Write latency | 20 µs |
S.M.A.R.T. support | Yes |
NVMe | Yes |
Mean time between failures (MTBF) | 2000000 h |
TBW rating | 700 |
SSD form factor | M.2 |
H/W PLP function | Yes |
M.2 SSD size | 2280 (22 x 80 mm) |
Drive writes per day (DWPD) | 0.4 |
Power |
---|
Power consumption (write) | 7.8 W |
Power consumption (read) | 3.36 W |
Average power consumption (write) | 7.36 W |
Average power consumption (read) | 3.26 W |
Performance |
---|
Interface | PCI Express 4.0 |
Component for | Server |
SSD capacity | 960 GB |
Read speed | 7000 MB/s |
Write speed | 1300 MB/s |
Memory type | 3D TLC |
PCI Express interface data lanes | x4 |
Random read (4KB) | 540000 IOPS |
Random write (4KB) | 47000 IOPS |
Read latency | 70 µs |
Write latency | 20 µs |
S.M.A.R.T. support | Yes |
NVMe | Yes |
Mean time between failures (MTBF) | 2000000 h |
TBW rating | 700 |
Design |
---|
Component for | Server |
Cooling type | Heatsink |
SSD form factor | M.2 |
Weight & dimensions |
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Width | 0.866" (22 mm) |
Depth | 3.15" (80 mm) |
Height | 0.35" (8.9 mm) |
Weight | 0.388 oz (11 g) |
Package width | 5.1" (129.5 mm) |
Package depth | 0.56" (14.2 mm) |
Package height | 7.25" (184.2 mm) |
Package weight | 1.26 oz (35.8 g) |
Packaging data |
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Package width | 5.1" (129.5 mm) |
Package depth | 0.56" (14.2 mm) |
Package height | 7.25" (184.2 mm) |
Package weight | 1.26 oz (35.8 g) |
Master (outer) case width | 5.35" (135.9 mm) |
Master (outer) case length | 8" (203.2 mm) |
Master (outer) case height | 2.75" (69.8 mm) |
Master (outer) case gross weight | 10.3 oz (292.6 g) |
Products per master (outer) case | 6 pc(s) |
Operational conditions |
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Operating temperature (T-T) | 0 - 70 °C |
Storage temperature (T-T) | -40 - 85 °C |
Non-operating vibration | 20 G |
Technical details |
---|
Interface | PCI Express 4.0 |
Operating temperature (T-T) | 0 - 70 °C |
Storage temperature (T-T) | -40 - 85 °C |
Non-operating vibration | 20 G |
SSD form factor | M.2 |
Other features |
---|
Cooling type | Heatsink |
Country of origin | China, Taiwan |
Logistics data |
---|
Master (outer) case width | 5.35" (135.9 mm) |
Master (outer) case length | 8" (203.2 mm) |
Master (outer) case height | 2.75" (69.8 mm) |
Master (outer) case gross weight | 10.3 oz (292.6 g) |
Products per master (outer) case | 6 pc(s) |
Country of origin | China, Taiwan |