Performance |
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Interface | Serial ATA III |
Component for | Server/workstation |
SSD capacity | 1.92 TB |
Read speed | 555 MB/s |
Write speed | 525 MB/s |
Memory type | 3D TLC |
Data transfer rate | 6 Gbit/s |
Random read (4KB) | 98000 IOPS |
Random write (4KB) | 24000 IOPS |
Read latency | 500 µs |
Write latency | 2000 µs |
Security algorithms | 256-bit AES |
S.M.A.R.T. support | Yes |
Power loss protection | Yes |
Hardware encryption | Yes |
End-to-End Data Protection | Yes |
Mean time between failures (MTBF) | 2000000 h |
TBW rating | 1752 |
Design |
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Component for | Server/workstation |
SSD form factor | 2.5" |
Features |
---|
Interface | Serial ATA III |
Component for | Server/workstation |
SSD capacity | 1.92 TB |
Read speed | 555 MB/s |
Write speed | 525 MB/s |
Memory type | 3D TLC |
Data transfer rate | 6 Gbit/s |
Random read (4KB) | 98000 IOPS |
Random write (4KB) | 24000 IOPS |
Read latency | 500 µs |
Write latency | 2000 µs |
Security algorithms | 256-bit AES |
S.M.A.R.T. support | Yes |
Power loss protection | Yes |
Hardware encryption | Yes |
End-to-End Data Protection | Yes |
Mean time between failures (MTBF) | 2000000 h |
TBW rating | 1752 |
SSD form factor | 2.5" |
Harmonized System (HS) code | 84717070 |
Power |
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Power consumption (average) | 1.6 W |
Power consumption (write) | 7.5 W |
Power consumption (read) | 1.8 W |
Operational conditions |
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Operating temperature (T-T) | 0 - 70 °C |
Storage temperature (T-T) | -40 - 85 °C |
Operating vibration | 2.17 G |
Non-operating vibration | 20 G |
Technical details |
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Interface | Serial ATA III |
Operating temperature (T-T) | 0 - 70 °C |
Storage temperature (T-T) | -40 - 85 °C |
Operating vibration | 2.17 G |
Non-operating vibration | 20 G |
SSD form factor | 2.5" |
Weight & dimensions |
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Width | 2.75" (69.9 mm) |
Depth | 3.94" (100 mm) |
Height | 0.276" (7 mm) |
Weight | 3.26 oz (92.3 g) |
Package type | Blister |
Packaging data |
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Package type | Blister |
Logistics data |
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Harmonized System (HS) code | 84717070 |